Fall 1998

Lectures: Th 9-10, 310 Maryland Hall

Lab section I: Th 10-2, Whitaker Microfabrication Lab - New Engineering Building 213

Lab section II: Fr 9-1 Whitaker Microfabrication Lab - New Engineering Building 213

Lab section III: Fr 1-5 Whitaker Microfabrication Lab - New Engineering Building 213

Staff

Professor Andreas G. Andreou,

Zaven Kalayjian, (Teaching Assistant)

Michael G. Erickson, (Teaching Assistant/Grader)

Grading

(20%) Weekly homework problems,

(30%) Written, mid-term examination

(30%) Written, final project report

(20%) Laboratory participation and lab-book

You can read here what is that you are suppose to submit every week in terms of laboratory writeups.

WWW

Course Website: http://www.ece.jhu.edu/~andreou/495/

Textbooks

Richard C. Jaeger, Introduction to Microelectronic Fabrication, Addison-Wesley. Additionally, lecture notes and journal articles will be handed out as appropriate.

CAD Tools

Some of the laboratory, may require the use of LEDIT, mask layout program.

Schedule and Syllabus

Week

Lecture topic(s)

Laboratory session

1

Organizational meeting, overview of microelectronic fabrication (Chapter 1), silicon for MEMS, K.E. Petersen 1982 paper

  

2

Laboratory safety, laboratory protocols

Lab # 1

Tour of laboratory and equipment, microscopy, profilometry.

3

Project description; Samaun et.al. 1973 paper

Lab # 2

CAD tools and mask design.

4

Thermal oxidation of silicon (Chapter 3)

Photolithography I (Chapter 2)

Lecture Notes

Lab # 3

Wafer oxidation.

5

Diffusion (Chapter 4)

Lab # 4

Boron diffusion, piezo-resistor formation.

6

Etching; wet, chemical and plasma

H. Seidel 1987 paper , K.E. Petersen 1982 paper

Lab # 5

Anisotropic etching, membrane formation.

7

Photolithography II (Chapter 2)

Lab # 6

Wafer characterization, contact cuts formation.

8

Film deposition (Chapter 6)

Lab # 7

Aluminum deposition, contact and interconnect formation.

9

Mid-term examination

Lab # 8

Wafer electrical characterization.

10

Ion implantation (Chapter 5)

Lab # 9

Wafer dicing, packaging, bonding.

11

Die processing and packaging (Chapter 8)

Lab # 10

Microsensor testing and characterization

12

CMOS and CMOS compatible MEMs technologies

  

13

Thanksgiving

  

14

Projects presentation and discussion

  

Note: The laboratory sessions may be shifted as one or more steps in the process may have to be repeated.

Homework Assignments

Homework #1

Homework # 2

Homework # 3

Homework # 4

Homework # 5

Homework # 6

References

  1. [SaWiAn73] Samaun, K.D. Wise and J. B. Angell, An IC Piezoresistive Pressure Sensor for Biomedical Instrumentation, IEEE Transactions on Biomedical Engineering, Vol. BME-20, No. 2, March 1973.
  2. [HSeid87] H. Seidel, The mechanism of anisotropic silicon etching and its relevance for micromachining, Transducers 1987, pp. 120-125, 1987 ( available as pdf document ).
  3. [KPete82] K. E. Petersen, Silicon as Mechanical Material, Proceedings of IEEE, vol. 70, no. 5, pp. 420-457, May 1982.

Useful Local Links
  1. An integrated pressure sensor: final report by Tim Edwards from the 1994 class. A nice description of what we will do in this course.
  2. How do I …. ? FAQ (not done yet!)

Links to Microfabrication and MEMS at Universities
  1. MEMS clearing house at ISI
  2. U.C. Berkeley MEMS page
  3. MIT MEMS page
  4. University of Michigan MEMS page
  5. U.C. Davis microfabrication laboratory
  6. Caltech micromachining laboratory

Acknowledgements

This course has been supported by a Whitaker Foundation Development grant and by a Kenan grant from the Whiting School of Engineering.

As of today (10/12/1998), thanks to the generous support of the Whitaker foundation, this course has a new home; a real clean room in the Biomedical Engineering Institute (to be) at Homewood campus

.

To see a tentative layout for the new facility click here!

Page maintained by A.G. Andreou, andreou@jhu.edu , Last update: October 12, 1998